Material:
Housing: LCP UL94V-0, Black
Terminal: C18400, Au 1u" Min, Plated On Contact Area
G/F Plated On Solder Area
Ni 20u" Min, Underplated Overall
Out / Inner Shell: SUS304, Ni 20u" Min Plated Overall
MID Plate: SUS301, Cleaning
Emi: SUS301, Ni 20u" Min, Plated Overall
Electric:
Rated Current: VBUS And Gnd Pin: 5.0A
Other Pin: 0.25A
Contact Resistance: 40mΩ Max (Initial)
50mΩ Max (After)
Insulation Resistance: 100MΩ Min
Dielectric Withstanding Voltage: 100V AC R.M.S.
Mating Force: 5N~20N
Unmating Force: 8N~20N (After Test: 6N~20N)
Lity: 10000 Cycles Min
Operating Condition: Temperature -40℃ ~ +85°C
Humidity 80% R, H Max
Salt Spray: 24H
Solder Ability: 245±5°C, 5±0.5s
IR Reflow: The Peak Temperature On The Board Shall
Be Maintained For 10 Seconds At 260°C. |
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